IEC TS 62878-2-3:2015描述了设备嵌入式基板的设计指南。设备嵌入式基板的设计指南与各种电子电路板的设计指南基本相同。IEC 62878的这一部分能够全面理解电路设计、结构设计、电路板设计、电路板制造、jisso（组装工艺）和产品测试。本发明适用于通过使用有机基材制造的器件嵌入式基板，其包括例如有源或无源器件、在电子布线板的制造过程中形成的分立元件以及片材形成的元件。

IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.