IEC 61760-2:20 21 RLV包含官方IEC国际标准及其红线版本。Redline版本仅提供英文版本，为您提供了一种快速简单的方法来比较IEC官方标准与其以前版本之间的所有变化。 IEC 61760-2:20 21规定了表面贴装器件（SMD）的运输和储存条件，以实现有源和无源表面贴装器件的无故障处理。（不考虑印制板的条件。） 本文件的目的是确保SMD用户在不影响质量和可靠性的情况下接收和存储可以进一步加工（如定位、焊接）的产品。SMD的不当运输和储存会导致劣化，并导致组装问题，例如可焊性差、分层和“爆裂”。从本文件第3版到上一版2的参考文献的交叉引用列于本文件的附录X。

IEC 61760-2:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.