本文展示了如何使用新仪器提供实时高度或材料体积测量，以改进SMT过程控制。给出了用于检查厚膜电阻器、锡膏体积、回流焊、焊接掩模、胶带自动焊接、引线共面性和陶瓷封装的三维计量示例。给出了利用三维测量提高产量的具体例子。

THIS PAPER SHOWS HOW NEW INSTRUMENTATION IS USED TO PROVIDE REAL-TIME HEIGHT OR MATERIAL VOLUME MEASUREMENTS FOR IMPROVED SMT PROCESS CONTROL. EXAMPLES ARE GIVEN OF 3-D METROLOGY FOR INSPECTING THICK FILM RESISTORS, SOLDER PASTE VOLUME, REFLOWED SOLDER, SOLDER MASK, TAPE AUTOMATED BONDING, LEAD COPLANARITY, AND CERAMIC PACKAGES. A SPECIFIC EXAMPLE OF YIELD IMPROVEMENTS USING 3-D MEASUREMENTS IS GIVEN.