IN A MOIRE INTERFEROMETER X-Y-Z MESH SENSOR, LARGE AMOUNTS OF DATA CAN BE COLLECTED IN A MATTER OF SECONDS. THIS CAPABILITY WILL OPEN NEW DOORS TO MANUFACTURING, AS A COMMON METHODOLOGY CAN BE USED FOR PART INSPECTION AND IN-PROCESS CONTROL. MOIRE INTERFEROMETRY DOES NOT SUFFER FROM THE LIMITATIONS OF CMM-TYPE TECHNOLOGY IN WHICH EXTENSIVE MECHANICAL MOTIONS ARE REQUIRED. NOR DOES IT SUFFER FROM THE LIMITATIONS OF A SINGLE POINT SENSOR IN WHICH ONE DATA POINT IS OBTAINED FOR EACH POSITION. THE TECHNOLOGY IS APPROPRIATE FOR MICROSCOPIC APPLICATIONS AS WELL AS FOR LARGE FIELD-OF-VIEW, LARGE STAND-OFF APPLICATIONS.