现行

GB/T 8976-1996

膜集成电路和混合膜集成电路总规范
Generic specification for film integrated circuits and hybrid film integrated circuits

1996-07-09

现行

IEC 60748-22-1997

Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
半导体器件 - 集成电路 - 第22部分:基于能力审批程序的薄膜集成电路和混合薄膜集成电路的分段规范

1997-04-10

现行

IEC 60748-21-1997

Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
半导体器件集成电路第21部分:分规范 薄膜集成电路和混合薄膜规范 基于资格认证的集成电路 程序

1997-04-10

现行

GB/T 11498-2018

半导体器件 集成电路 第21部分：膜集成电路和混合膜集成电路分规范（采用鉴定批准程序）
Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures

2018-12-28

现行

IEC 60748-20-1988

Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
半导体器件 集成电路 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

1988-06-30

现行

KS C IEC 60748-20

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 일반 규격서
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

2019-12-31

现行

KS C IEC 60748-2-20

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 하이브리드 필름 집적회로의 일반 규격서
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

2019-12-31

现行

KS C IEC 60748-20

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 일반 규격서
半导体器件集成电路第20部分:薄膜集成电路和混合薄膜集成电路总规范

2021-12-29

现行

IEC 60748-20-1-1994

Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范 - 第1部分:内部目视检查的要求

1994-03-01

现行

KS C IEC 60748-20-1(2019 Confirm)

반도체 소자 - 집적회로 제20-1부 : 필름 집적회로 및 하이브리드 필름 집적회로의 일반 규격서 - 내부 육안검사 요구사항
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范 - 第1部分:内部目视检查的要求

2003-12-31

现行

GB/T 43035-2023

半导体器件 集成电路 第20部分：膜集成电路和混合膜集成电路总规范 第一篇：内部目检要求
Semiconductor devices—Integrated circuits—Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits—Section 1: Requirements for internal visual examination

2023-09-07

现行

IEC 60748-20-1988/AMD1-1995

Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
修改件1——半导体器件 集成电路 第20部分:薄膜集成电路和混合薄膜集成电路总规范

1995-09-22

现行

BS QC 760200-1997

Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
电子元件质量评定协调体系 半导体器件 集成电路 基于能力批准程序的薄膜集成电路和混合薄膜集成电路分规范

1997-08-15

现行

BS QC 760100-1997

Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
电子元件质量评定协调体系 半导体器件 集成电路 基于鉴定批准程序的薄膜集成电路和混合薄膜集成电路分规范

1997-08-15

现行

BS CECC 63100-1985

Harmonized system of quality assessment for electronic components: sectional specification: film and hybrid integrated circuits
电子元件质量评定协调体系:分规范:薄膜和混合集成电路

1985-01-31

现行

BS EN 165000-1-1996

Film and hybrid integrated circuits-Generic specification. Capability approval procedure
薄膜和混合集成电路 通用规范 能力批准程序

1996-10-15

现行

BS QC 760000-1990

Harmonized system of quality assessment for electronic components. Film and hybrid film integrated circuits. Generic specification
电子元件质量评定协调体系 薄膜和混合薄膜集成电路 总规范

1990-04-30

现行

IEC 60748-21-1-1997

Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
半导体器件集成电路第21-1部分:坯料 薄膜集成电路和混合薄膜详细规范 基于资格认证的集成电路 程序

1997-04-10

现行

IEC 60748-22-1-1997

Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
半导体器件 - 集成电路 - 第22-1部分:基于能力审批程序的薄膜集成电路和混合薄膜集成电路的空白详细规范

1997-04-10

现行

GB/T 13062-2018

半导体器件 集成电路 第21-1部分：膜集成电路和混合膜集成电路空白详细规范（采用鉴定批准程序）
Semiconductor devices—Integrated circuits—Part 21-1：Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures

2018-12-28