Fine ceramics (advanced ceramics, advanced technical ceramics) --Test method for thermal property measurements of metalized ceramic substrates — Part 1: Evaluation of thermal resistance for use in power modules
精细陶瓷(高级陶瓷、高级工业陶瓷)金属化陶瓷基片热性能测量的试验方法第1部分:功率模块用热阻的评定
This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.