IEC 60749-10:2022旨在评估处于自由状态并组装到印刷线路板上用于电气设备的设备。该方法旨在确定设备和组件的兼容性，以承受中等严重冲击。使用子组件是在组装到印刷线路板的使用条件下测试设备的一种方法。由于突然施加的力或搬运、运输或现场操作产生的运动突变而产生的机械冲击可能会干扰操作特性，尤其是在冲击脉冲重复的情况下。这是一种破坏性测试，用于设备鉴定。 本版本取消并取代2002年出版的第一版。与前一版相比，本版包括以下重大技术变更:；包括未连接的组件和连接到印刷线路板的组件；针对峰值加速度和脉冲持续时间修改的公差极限； 增加了速度变化和等效跌落高度的数学公式。

IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:;covers both unattached components and components attached to printed wiring boards;tolerance limits modified for peak acceleration and pulse duration;mathematical formulae added for velocity change and equivalent drop height.