现行

SJ 21098-2016

印制板显微剖切方法及要求
Test methods and requirements of microsection for printed circuit boards

2016-01-19

现行

GOST 23752.1-1992

Платы печатные. Методы испытаний
印刷电路板 测试方法

现行

QJ 1889A-2012

印制电路板显微剖切检验要求
Testing requirement for microsectioning of printed circuit board

2013-01-04

现行

SJ 21096-2016

印制板环境试验方法
Test method of environmental for printed circuit boards

2016-01-19

现行

SJ 21094-2016

印制板化学性能测试方法
Test method of chemical performance for printed circuit boards

2016-01-19

现行

SJ 21095-2015

印制板机械性能测试方法
Test method of mechanical performance for printed circuit boards

2016-01-19

现行

SJ 21093-2016

印制板物理性能测试方法
Test method of physical performance for printed circuit boards

2016-01-19

现行

GOST R 55744-2013

Платы печатные. Методы испытаний физических параметров
印刷电路板 物理参数测试方法

现行

SJ 21548-2020

印制电路板组装件静态应变测试方法
Test method of static strain gage for printed circuit board assemblies

2020-06-03

现行

GOST R 56252-2014

Платы печатные. Контроль влияния химических факторов и воздействия окружающей среды
印刷电路板 化学因素和环境影响测试方法

现行

GB/T 4722-2017

印制电路用刚性覆铜箔层压板试验方法
Test methods for rigid copper clad laminates for printed circuits board

2017-05-31

现行

GOST R 50562-1993

Оригиналы и фотошаблоны печатных плат. Общие требования к типовым технологическим процессам изготовления
印刷电路板的原稿和标记 单位制造方法的一般要求

现行

BS PD IEC/TR 61189-3-914-2017

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
电气材料、印制板和其他互连结构和组件的试验方法

2017-03-31

现行

ISO 9455-18-2024

Soft soldering fluxes — Test methods — Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning
软钎焊剂试验方法第18部分:清洁前后焊接印刷电路组件的清洁度

2024-08-16

现行

KS C IEC TR 61189-3-914

전기재료, 인쇄기판 및 다른 상호접속용 구조 및 조립품에 대한 시험방법 — 제3-914부: 고휘도 LED용 인쇄회로기판의 열전도성 시험방법 — 지침
电气材料、印刷电路板和其他互连结构和组件的试验方法.第3-914部分:高亮度LED用印刷电路板的导热性试验方法.指南

2023-06-30

现行

IEC TR 61189-3-914-2017

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
电气材料、印制板和其他互连结构和组件的试验方法.第3-914部分:高亮度LED用印制电路板导热性的试验方法.指南

2017-03-17

现行

IPC 2547

Sectional Requirements for Shop Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework
印制电路板试验、检验和返工用车间设备通信信息（CAMX）的分要求

2002-01-01

现行

CY/T 156-2017

印刷品裱贴瓦楞纸板过程控制要求及检验方法
The process control requirements and test methods for corrugated board laminating with printed paper

2017-05-18

现行

BS EN IEC 61189-5-503-2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies-General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
电气材料、印制板和其他互连结构和组件的试验方法

2018-04-13

现行

IEC 61189-3-913-2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第3-913部分:高亮度LED电子电路板的导热性测试方法

2016-01-05