现行

ASM Sn-13

INDALLOY 227 - Lead-Free Solder
IND合金227-无铅焊料

1998-01-01

现行

YS/T 747-2010

无铅锡基焊料
Lead-free tin-based solder

2010-11-22

现行

ASM Sn-13

INDALLOY 227 - Lead-Free Solder
IND合金227-无铅焊料

1998-01-01

现行

KS D 8545

수지 플럭스 코어 무연 연납
树脂药芯焊丝无铅焊料

2018-12-17

现行

KS D 8545(2023 Confirm)

수지 플럭스 코어 무연 연납
树脂药芯无铅焊料

2018-12-17

现行

JB/T 10845-2008

无铅再流焊接通用工艺规范
General technological specification for lead-free reflow soldering

2008-02-01

现行

SJ/T 11697-2018

无铅元器件焊接工艺适应性规范
Applicability specification of soldering process for lead free component

2018-02-09

现行

BS PD IEC/TS 62647-3-2014

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Performance testing for systems containing lead-free solder and finishes
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统

2014-03-31

现行

SAE GEIASTD0005_1B

Standard for Developing a Lead-Free Control Plan to Manage the Risks of Lead-Free Solders and Finishes in Aerospace, Defense, and High-Performance Soldered Electronic Products
制定无铅控制计划以管理航空航天、国防和高性能焊接电子产品中无铅焊料和表面处理的风险的标准

2023-08-01

现行

KS D 8546

무연 연납 — 화학 조성과 형상
无铅软钎料合金 化学组成和形态

2018-12-17

现行

KS D 8546(2023 Confirm)

무연 연납 — 화학 조성과 형상
无铅软焊料合金.化学成分和形式

2018-12-17

现行

JIS Z 3198-6-2003

Test methods for lead-free solders -- Part 6: Methods for 45�pull test of solder joints on QFP lead
无铅焊料试验方法第6部分:QFP铅焊点45°拉力试验方法

2003-01-01

现行

IEC TS 62647-3-2014

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第3部分:含无铅焊料和饰面的系统的性能试验

2014-02-25

现行

GB/T 41275.3-2022

航空电子过程管理 含无铅焊料航空航天及国防电子系统 第3部分：含无铅焊料和无铅管脚的系统性能试验方法
Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3：Performance testing for systems containing lead-free solder and finishes

2022-03-09

现行

BS PD IEC/TS 62647-1-2012

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Preparation for a lead-free control plan
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统

2012-11-30

现行

SAE USCAR40-2

LEAD-FREE SOLDER VALIDATION TEST PLAN (Stabilized: Nov 2020)
无铅焊料验证测试计划（稳定期:2020年11月）

2020-11-19

现行

ASM Pb-8

LEAD-BASE SOLDER - Lead-Base Solder
铅基焊料-铅基焊料

1971-10-01

现行

ASM Pb-8

LEAD-BASE SOLDER - Lead-Base Solder
铅基焊料-铅基焊料

1971-10-01

现行

JIS Z 3198-3-2003

Test methods for lead-free solders -- Part 3: Methods for spread test
无铅焊料试验方法第3部分:无铅焊料试验方法

2003-01-01

现行

IEC TS 62647-1-2012

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第1部分:无铅控制计划的准备

2012-08-09