首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 IEC 62047-10:2011
到馆阅读
收藏跟踪
购买正版
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials 半导体器件 - 微机电器件 - 第10部分:MEMS材料的微柱压缩测试
发布日期: 2011-07-26
IEC 62047-10:2011规定了微柱压缩试验方法,用于测量MEMS材料的压缩性能,具有高精度、可重复性和中等强度的试样制作。测量了试件的单轴压缩应力应变关系,得到了压缩弹性模量和屈服强度。本标准适用于金属、陶瓷和聚合物材料。 本副本包含2012年2月勘误表的内容。
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.
分类信息
关联关系
研制信息
归口单位: TC 47/SC 47F
相似标准/计划/法规
现行
IEC 62047-20-2014
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
半导体器件微机电器件第20部分:陀螺仪
2014-06-26
现行
BS 10/30211442 DC
BS EN 62047-10. Semiconductor devices. Micro electromechanical devices. Part 10. Micro-pillar compression test for MEMS materials
英国标准EN 62047-10 半导体器件 微型机电设备 第十部分 MEMS材料的微柱压缩试验
2010-03-11
现行
IEC 62047-1-2016
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
半导体器件 - 微机电器件 - 第1部分:术语和定义
2016-01-06
现行
IEC 62047-19-2013
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
半导体器件 - 微机电器件 - 第19部分:电子罗盘
2013-07-17
现行
GB/T 42709.19-2023
半导体器件 微电子机械器件 第19部分:电子罗盘
Semiconductor devices—Micro-electromechanical devices—Part 19: Electronic compasses
2023-08-06
现行
IEC 62047-40-2021
Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
半导体器件.微机电器件.第40部分:微机电惯性冲击开关阈值的试验方法
2021-09-03
现行
IEC 62047-4-2008
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
半导体器件 - 微机电器件第4部分:Mems的通用规范
2008-08-21
现行
IEC 62047-5-2011
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
半导体器件 - 微机电器件 - 第5部分:RF MEMS开关
2011-07-13
现行
GB/T 42709.5-2023
半导体器件 微电子机械器件 第5部分:射频MEMS开关
Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches
2023-05-23
现行
IEC 62047-33-2019
Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
半导体器件微机电器件第33部分:MEMS压阻压敏器件
2019-04-05
现行
IEC 62047-43-2024
Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
半导体器件.微机电器件.第43部分:柔性微机电器件循环弯曲变形后电气特性的试验方法
2024-03-19
现行
IEC 62047-41-2021
Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
半导体器件.微机电器件.第41部分:RF MEMS环行器和隔离器
2021-06-15
现行
DIN EN 62047-10
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
半导体器件.微机电器件.第10部分:MEMS材料的微柱压缩试验(IEC 62047-10-2011);德文版EN 62047-10:2011
2012-03-01
现行
IEC 62047-26-2016
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
半导体器件 - 微机电器件 - 第26部分:微沟槽和针结构的描述和测量方法
2016-01-07
现行
IEC 62047-11-2013
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
半导体器件 - 微机电器件 - 第11部分:用于微机电系统的自由立体材料的线性热膨胀系数的测试方法
2013-07-17
现行
IEC 62047-22-2014
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
半导体器件微机电器件第22部分:柔性衬底上导电薄膜的机电拉伸试验方法
2014-06-19
现行
IEC 62047-18-2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
半导体器件 - 微机电器件 - 第18部分:薄膜材料的弯曲测试方法
2013-07-17
现行
IEC 62047-32-2019
Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
半导体器件微机电器件第32部分:MEMS谐振器非线性振动的试验方法
2019-01-24
现行
KS C IEC 62047-18
반도체 소자 ― 초소형 전기기계소자 ― 제18부: 박막 재료의 굽힘 시험방법
半导体器件 - 微机电装置 - 第18部分:薄膜材料弯曲试验方法
2016-12-29
现行
KS C IEC 62047-22
반도체 소자 ― 초소형 전기기계소자 ― 제22부: 유연 기판의 전도성 박막용 전기기계 인장 시험방법
半导体器件 - 微机电装置 - 第18部分:薄膜材料弯曲试验方法
2016-12-29