IEC 60747-15:20 24 RLV包含官方IEC国际标准及其红线版本。Redline版本仅提供英文版本，为您提供了一种快速简单的方法来比较IEC官方标准与其以前版本之间的所有变化。 IEC 60747-15:20 24给出了隔离功率半导体器件的要求。这些要求是IEC 60747其他部分中针对相应非隔离功率器件和IEC 60748部分中针对IC给出的要求之外的要求。与上一版相比，第三版包含以下重大技术变更: a)以前从第一版和第二版中排除的智能功率半导体模块（IPM）现在包括在本文件中（附录C）； b)描述了每个开关的热阻(6.2.4)； c）在与用户达成协议的情况下，增加了温度传感器和端子之间的隔离测试（6.1.2）。

IEC 60747-15:2024 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 60747-15:2024 gives the requirements for isolated power semiconductor devices. These requirements are additional to those given in other parts of IEC 60747 for the corresponding non-isolated power devices and parts of IEC 60748 for ICs. This third edition includes the following significant technical changes with respect to the previous edition:
a) The intelligent power semiconductor modules (IPM), which was previously excluded from the first and second edition, is now included in this document (Annex C);
b) The thermal resistance is described for each switch (6.2.4);
c) Added isolation test between temperature sensor and terminals, in case there is an agreement with the user (6.1.2).