IEC 60947-7-4:20 19作为IEC 60947-7-4:20 19 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 60947-7-4:20 19规定了主要用于工业或类似用途的PCB端子板的要求。通过焊接、压入或等效方法在印刷电路板上进行安装和固定，以在铜导体和印刷电路板之间提供电和机械连接。本文件适用于用于连接铜导体的PCB端子板，无论是否经过特殊处理，横截面在0.08 mm2和300 mm2之间（AWG 28-600 kcmil），用于额定电压不超过1 000 V AC至1 000 Hz或1 500 V DC的电路。这第二版取消并取代了2013年出版的第一版。本版构成技术修订版。与上一版相比，此版本包括以下重大技术变更: a)带夹紧单元的PCB端子板的附加测试，其中接触压力通过绝缘材料传递； b)螺钉的拧紧扭矩现在在本文件的表4中给出（先前在IEC 60947-1:20 07的表4中给出）；为其他类型的螺钉增加的拧紧扭矩； c)引入了验证接触电阻的新标准； d)在温升测试(电流-温度降额)的描述中进行澄清；根据图4对测试序列进行校正。

IEC 60947-7-4:2019 is available as IEC 60947-7-4:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60947-7-4:2019 specifies requirements for PCB terminal blocks primarily intended for industrial or similar use. Mounting and fixing on the printed circuit board is made by soldering, press-in or equivalent methods to provide electrical and mechanical connection between copper conductors and the printed circuit board. This document applies to PCB terminal blocks intended to connect copper conductors, with or without special preparation, having a cross-section between 0,08 mm2 and 300 mm2 (AWG 28-600 kcmil), intended to be used in circuits of a rated voltage not exceeding 1 000 V AC up to 1 000 Hz or 1 500 V DC. This second edition cancels and replaces the first edition published in 2013. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) additional test for PCB terminal blocks with clamping units, where contact pressure is transmitted through insulating materials;
b) tightening torques for screws now given in Table 4 of this document (previously given in Table 4 of IEC 60947-1:2007); tightening torques added for an additional type of screw;
c) new criteria for verification of contact resistance introduced;
d) clarification in the description of the temperature-rise test (current-temperature derating); corrections in the test sequence according to Figure 4.