本文件是一系列文件中的另一份，专门讨论电子组装中使用的非IC组件的预处理。组件是否与您的流程配合使用？这种确定是这些制造过程模拟的目标；确保所选部件在暴露于工厂工艺后满足预期的可靠性要求。为用户和制造商开发的程序包括一组模拟，用于非IC组件的存储和使用、波峰焊和回流焊（SMT和PTH零件）、腐蚀性（水溶性）焊剂的暴露，以及经常接触- 用过的清洁材料。

This document is another in a series and specifically addresses preconditioning of non-IC components used in electronic assembly. Do the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations, for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes, and exposure to often-used cleaning materials.