现行

ASTM F72-24

Standard Specification for Gold Wire for Semiconductor Lead Bonding
半导体引线键合用金线的标准规范

2024-04-01

现行

GB/T 8750-2022

半导体封装用金基键合丝、带
Gold-based bonding wire and bandlet for semiconductor package

2022-12-30

现行

GB/T 34502-2017

封装键合用镀金银及银合金丝
Gold-coated silver and silver alloy bonding wires for semiconductor package

2017-09-29

现行

SJ/T 10626-1995

键合金丝中微量杂质的ICP发射光谱分析方法
Method for determining impurities in gold wire for semiconductor lead bonding by ICP-AES

1995-04-22

现行

YS/T 678-2008

半导体器件键合用铜丝
Copper wire for semiconductor lead bonding

2008-03-12

现行

YS/T 641-2007

半导体器件键合用铝丝
Aluminium wire for semiconductor lead bonding

2007-04-13

现行

YS/T 1105-2016

半导体封装用键合银丝
Silver bonding wire for semiconductor package

2016-04-05

现行

GB/T 34507-2017

封装键合用镀钯铜丝
Palladium coated copper bonding wire for semiconductor package

2017-10-14

现行

SJ 21453-2018

集成电路陶瓷封装金丝键合工艺技术要求
Integrated circuit ceramic package-Technical requirements for gold wire bonding process

2018-01-18

现行

GB/T 41853-2022

半导体器件 微机电器件 晶圆间键合强度测量
Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement

2022-10-12

现行

BS EN 60749-22-2003

Semiconductor devices. Mechanical and climatic test methods-Bond strength
半导体器件 机械和气候试验方法

2003-07-04

现行

SJ/T 10705-1996

半导体器件键合丝表面质量检验方法
Standard practice for inspection of surface quality of semiconductor lead-bonding wire

1996-07-22

现行

BS EN 62047-9-2011

Semiconductor devices. Micro-electromechanical devices-Wafer to wafer bonding strength measurement for MEMS
半导体器件 微机电设备

2013-01-31

现行

YS/T 543-2015

半导体键合用铝-1%硅细丝
Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding

2015-04-30

现行

BS EN 62047-15-2015

Semiconductor devices. Micro-electromechanical devices-Test method of bonding strength between PDMS and glass
半导体器件 微机电设备

2015-07-31

现行

BS IEC 62047-27-2017

Semiconductor devices. Micro-electromechanical devices-Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
半导体器件 微机电设备

2020-07-22

现行

IEC 60749-22-2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
半导体器件 - 机械和气候测试方法 - 第22部分:粘结强度

2002-09-12

现行

KS C IEC 60749-22

반도체 소자 — 기계 및 기후적 환경 시험방법 — 제22부: 접합 강도
半导体器件 - 机械和气候测试方法 - 第22部分:粘结强度

2020-07-23

现行

UNE-EN 60749-22-2004

Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
半导体器件机械和气候试验方法第22部分:结合强度

2004-03-26

现行

GB/T 4937.22-2018

半导体器件 机械和气候试验方法 第22部分：键合强度
Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength

2018-09-17