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现行 JEDEC J-STD-609B
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MARKING, SYMBOLS, AND LABELS OF LEADED AND LEAD-FREE TERMINAL FINISHED MATERIALS USED IN ELECTRONIC ASSEMBLY 电子组装用含铅和无铅终端成品材料的标记、符号和标签
发布日期: 2016-04-01
本标准适用于含有无铅和含铅焊料和饰面的部件和组件。本标准描述了组件的标记及其装运集装箱的标签,以识别其二级终端饰面或材料,并适用于拟通过焊接或机械夹紧或压装连接到板或组件上的组件。本标准也适用于用于直接板连接的凸模的二级端子材料。
This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This standard describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit. This standard also applies to 2nd level terminal materials for bumped die that are used for direct board attach.
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发布单位或类别: 美国-JEDEC固态技术协会
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