Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
电气材料、印制板和其他互连结构和组件的试验方法
BS PD IEC/TR 61189-3-914:2017 specifies the detailed procedures and precautions for IEC 61189-3-913.Cross References:IEC 60194IEC 60068-1:2013IEC 61189-3-913EIA/JEDEC STD 51-2All current amendments available at time of purchase are included with the purchase of this document.