微机电系统（MEMS）技术 基于光学干涉的MEMS微结构残余应变测量方法
Micro-electromechanical system technology—Measuring method for residual strain measurements of MEMS microstructures using an optical interferometer

2017-11-01

微机电系统（MEMS）技术 微沟槽和棱锥式针结构的描述和测量方法
Micro-electromechanical systems technology（MEMS） —Description and measurement methods for micro trench and pyramidal needle structures

2023-03-17

微机电系统（MEMS）技术 带状薄膜抗拉性能的试验方法
Micro-electromechanical system technology—Test methods for tensile property measurement of strip thin films

2020-03-06

微机电系统（MEMS）技术 基于拉曼光谱法的微结构表面应力测试方法
Micro-electromechanical system technology—Measuring method of microstructure surface stress based on Raman spectroscopy

2017-11-01

微机电系统（MEMS）技术 基于光学干涉的MEMS微结构面内长度测量方法
Micro-electromechanical system technology—Measuring method for in-plane length measurements of MEMS microstructures using an optical interferometer

2017-11-01

微机电系统(MEMS)技术　MEMS器件的可靠性综合环境试验方法
Micro-electromechanical system technology—The reliability test methods of MEMS in integrated environments

2019-12-31

微机电系统（MEMS）技术 薄膜材料的弯曲试验方法
Micro-electromechanical systems （MEMS） technology—Bend testing methods of thin film materials

2024-10-26

微机电系统（MEMS）技术 MEMS谐振敏感元件非线性振动测试方法
Micro electromechanical system technology—Test method for the nonlinear vibration of the MEMS resonant sensitive element

2017-11-01

微机电系统（MEMS）技术 MEMS结构共振疲劳试验方法
Micro-electromechanical system technology—Fatigue testing method of MEMS structure using resonant vibration

2020-03-06

微机电系统（MEMS）技术 硅基MEMS纳尺度结构冲击试验方法
Micro-electromechanical systems（MEMS） technology—Impact test method for nanostructures of silicon based MEMS

2023-08-06

微机电系统（MEMS）技术 硅基MEMS微结构弯曲强度试验方法
Micro-electromechanical systems（MEMS）technology—Bending strength test method for microstructures of silicon based MEMS

2023-08-06

Semiconductor devices. Micro-electromechanical devices-Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
半导体器件 微机电设备

2016-11-30

微机电系统（MEMS）技术 硅基MEMS纳米厚度膜抗拉强度试验方法
Micro-electromechanical systems（MEMS） technology—Tensile strength test method for nano-scale membranes of silicon based MEMS

2023-08-06

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
半导体器件 - 微机电器件 - 第25部分:硅基存储器制造技术 - 微接合区域的拉压和剪切强度测量方法

2016-08-29

Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
半导体器件.微机电器件.第47部分:硅基MEMS制造技术.微结构弯曲强度的测量方法

2024-08-23

微机电系统（MEMS）技术 层状MEMS材料界面黏附能四点弯曲试验方法
Micro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials

2024-09-29

BS EN 62047-14. Semiconductor devices. Micro-electromechanical systems. Part 14. Forming limit measuring method of metallic film materials
英国标准EN 62047-14 半导体器件 微机电系统 第14部分 金属薄膜材料成形极限测量方法

2010-07-19

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
半导体器件.微机电器件.第25部分:硅基MEMS制造技术.微键合区域拉压和剪切强度的测量方法（IEC 62047-25-2016）；德文版EN 62047-25:2016

2017-04-01