IEC 62878-1-1:2015规定了无源和有源器件嵌入式基板的试验方法。IEC 61189-3规定了印刷线路基板材料和基板本身的基本试验方法。IEC 62878的本部分适用于通过使用有机基材制造的设备嵌入式基板，例如，包括有源或无源设备、在电子线路板制造过程中形成的分立组件以及片状组件。

IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.