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现行 BS IEC 62047-31:2019
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Semiconductor devices. Micro-electromechanical devices-Four-point bending test method for interfacial adhesion energy of layered MEMS materials 半导体器件 微机电设备
发布日期: 2019-04-17
BS IEC 62047-31:2019规定了一种测量界面应力的四点弯曲试验方法 层状微机电系统中最弱界面的粘着能 (MEMS)基于断裂力学的概念。在各种MEMS设备中,有 许多层状材料的界面及其粘附能对材料的可靠性至关重要 MEMS设备。交叉引用:IEC 62047-2:2006IEC 62047-3:2006购买本文件时可获得的所有现行修改件均包含在购买本文件中。
BS IEC 62047-31:2019 specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics. In a variety of MEMS devices, there are many layered material interfaces, and their adhesion energies are critical to the reliability of the MEMS devices.Cross References:IEC 62047-2:2006IEC 62047-3:2006All current amendments available at time of purchase are included with the purchase of this document.
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发布单位或类别: 英国-英国标准学会
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