Semiconductor devices. Micro-electromechanical devices-Four-point bending test method for interfacial adhesion energy of layered MEMS materials
半导体器件 微机电设备
BS IEC 62047-31:2019 specifies a four-point bending test method for measuring interfacial
adhesion energy of the weakest interface in the layered micro-electromechanical systems
(MEMS) based on the concept of fracture mechanics. In a variety of MEMS devices, there are
many layered material interfaces, and their adhesion energies are critical to the reliability of
the MEMS devices.Cross References:IEC 62047-2:2006IEC 62047-3:2006All current amendments available at time of purchase are included with the purchase of this document.