Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
电子组装技术 - 第4部分:面阵列式封装表面贴装器件焊接接头的耐久性测试方法

2014-10-09

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
电子组装技术 - 第3部分:焊接环境和耐久性测试方法的选择指导

2011-11-08

Технология сборки изделий электроники. Часть 3. Руководство по выбору методов экологических и ресурсных испытаний для паяных соединений
电子组装技术 第3部分焊点环境和耐久试验方法的选择指导

Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints
电子组装技术

2012-03-31

전자부품 조립기술－납땜접합에 대한 환경 및 내구성 시험방법 선택 안내
电子组装技术焊点环境和耐久性试验方法选择指南

2012-11-19

전자부품 조립기술－납땜접합에 대한 환경 및 내구성 시험방법 선택 안내
电子组装技术－焊点环境和耐久性试验方法的选择指南

2012-11-19

Electronics assembly technology-Endurance test methods for solder joint of area array type package surface mount devices
电子组装技术 面阵型封装表面安装器件焊点耐久性试验方法

2015-06-30

BS EN 62137-3. Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
英国标准EN 62137-3 电子组装技术 焊点环境和耐久性试验方法的选择指南

2009-06-30

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
电子组装技术.第4部分:面阵型封装表面安装器件焊点的耐久性试验方法（IEC 62137-4-2014）；德文版EN 62137-4:2014+AC:2015

2015-07-01

Draft Document - Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints (IEC 91/876/CD:2009)
文件草案.电子组装技术.焊点环境和耐久性试验方法的选择指南（IEC 91/876/CD:2009）

2009-10-01

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
表面贴装技术 - 表面贴装焊接接头的环境和耐久性试验方法 - 第1-4部分:循环弯曲试验

2009-01-26

표면실장기술 — 표면실장 솔더 접합부에 대한 환경 및 내구성 시험방법 — 제1-4부: 반복 굽힘 시험
表面安装技术表面安装焊点的环境和耐久性试验方法第1-4部分:循环弯曲试验

2024-06-07

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012
电子组装技术.第3部分:焊点环境和耐久性试验方法的选择指南（IEC 62137-3-2011）；德文版EN 62137-3:2012

2012-08-01

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009); German version EN 62137-1-4:2009
表面安装技术.表面安装焊点的环境和耐久性试验方法.第1-4部分:循环弯曲试验（IEC 62137-1-4-2009）；德文版EN 62137-1-4:2009

2009-08-01