首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 KS C IEC 62951-1-2022
到馆提醒
收藏跟踪
购买正版
반도체소자 — 유연성 및 신축성 반도체소자 — 제1부: 유연성 기판의 전도성 박막에 대한 굽힘 시험방법 半导体器件.柔性和可拉伸半导体器件.第1部分:柔性衬底上导电薄膜的弯曲试验方法
发布日期: 2022-11-22
该标准规定了一种弯曲试验方法,用于测定在柔性非导电基板上沉积或粘附的导电薄膜的机电特性或弹性。柔性基板的导电薄膜广泛用于柔性电子元件及柔性半导体。导电薄膜包括在非导电柔性基板上沉积或粘附的所有膜,如金属薄膜、透明电极和硅薄膜。柔性基板薄膜的电学和机械行为与膜与基板之间的界面相互作用及粘接引起的独立薄膜及基板不同。该标准的目的是建立一种简单、可重复的试验方法,以评估柔性基板导电薄膜的机电特性或弹性。弯曲试验方法包括外侧弯曲试验和内侧弯曲试验。
이 표준은 플렉시블 비전도성 기판에 증착되거나 접착된 전도성 박막의 전기 기계적 특성 또는 신축성을 측정하기 위한 굽힘 시험방법을 규정한다. 플렉시블 기판의 전도성 박막은 플렉시블 전자 소자 및 플렉시블 반도체에 광범위하게 사용된다. 전도성 박막에는 금속 박막, 투명전극 및 실리콘 박막 같은 비전도성 플렉시블 기판에 증착 또는 접착된 모든 막이 포함된다. 플렉시블 기판 박막의 전기적 및 기계적 거동은 막과 기판 사이의 계면 상호작용 및 접착으로 인한 독립 박막 및 기판과 다르다. 이 표준의 목적은 플렉시블 기판의 전도성 박막의 전기 기계적 특성 또는 신축성을 평가하기 위한 간단하고 반복 가능한 시험방법을 설정하는 것이다. 굽힘 시험방법에는 외측 굽힘 시험과 내측 굽힘 시험이 포함된다.
分类信息
关联关系
研制信息
相似标准/计划/法规
现行
DLS-MIL-STD-750F-2012
Test Methods For Semiconductor Devices
Test Methods For Semiconductor Devices
2012-01-03
现行
IEC 62951-8-2023
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 8: Test method for stretchability, flexibility, and stability of flexible resistive memory
半导体器件.柔性和可拉伸半导体器件.第8部分:柔性电阻存储器的可拉伸性、柔性和稳定性的试验方法
2023-01-19
现行
BS IEC 62951-4-2019
Semiconductor devices. Flexible and stretchable semiconductor devices-Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
半导体器件 柔性可伸缩半导体器件
2019-03-05
现行
BS IEC 62951-5-2019
Semiconductor devices. Flexible and stretchable semiconductor devices-Test method for thermal characteristics of flexible materials
半导体器件 柔性可伸缩半导体器件
2019-03-05
现行
IEC 62951-4-2019
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
半导体器件.柔性和可伸展半导体器件.第4部分:柔性半导体器件衬底上柔性导电薄膜的疲劳评价
2019-02-27
现行
BS IEC 62951-6-2019
Semiconductor devices. Flexible and stretchable semiconductor devices-Test method for sheet resistance of flexible conducting films
半导体器件 柔性可伸缩半导体器件
2019-05-15
现行
IEC 62951-5-2019
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
半导体器件.柔性和可伸展半导体器件.第5部分:柔性材料热特性的试验方法
2019-02-27
现行
BS IEC 62951-7-2019
Semiconductor devices. Flexible and stretchable semiconductor devices-Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
半导体器件 柔性可伸缩半导体器件
2019-03-06
现行
IEC 62951-6-2019
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
半导体器件.柔性和可拉伸的半导体器件.第6部分:柔性导电薄膜片电阻的试验方法
2019-05-06
现行
BS IEC 62951-2-2019
Semiconductor devices. Flexible and stretchable semiconductor devices-Evaluation method for electron mobility, sub-threshold swing, and threshold voltage of flexible devices
半导体器件 柔性可伸缩半导体器件
2019-04-30
现行
IEC 62951-1-2017
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
半导体器件 - 柔性和可拉伸半导体器件 - 第1部分:柔性基板上导电薄膜的弯曲试验方法
2017-04-10
现行
IEC 62951-7-2019
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
半导体器件.柔性和可拉伸半导体器件.第7部分:表征柔性有机半导体薄膜封装阻挡性能的试验方法
2019-02-27
现行
IEC 62951-2-2019
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Evaluation method for electron mobility, sub-threshold swing and threshold voltage of flexible devices
半导体器件.柔性和可伸展半导体器件.第2部分:柔性器件的电子迁移率、亚阈值摆幅和阈值电压的评估方法
2019-04-17
现行
IEC 62951-3-2018
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging
半导体器件 - 柔性和可拉伸半导体器件 - 第3部分:凸出下柔性基板上薄膜晶体管特性的评估
2018-11-07
现行
BS IEC 62830-8-2021
Semiconductor devices. Semiconductor devices for energy harvesting and generation-Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics
半导体器件 用于能量收集和发电的半导体器件
2021-11-04
现行
IEC 62830-8-2021
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 8: Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics
半导体器件.能量收集和发电用半导体器件.第8部分:低功率电子设备用柔性和可拉伸超级电容器的试验和评估方法
2021-10-22
现行
IEC 62951-9-2022
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 9: Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells
半导体器件.柔性和可拉伸半导体器件.第9部分:单晶体管和单电阻器(1T1R)电阻存储单元的性能测试方法
2022-12-14
现行
DIN EN 62951-1-DRAFT
Draft Document - Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates (IEC 47/2224/CD:2015)
文件草稿.半导体器件.柔性和可拉伸半导体器件.第1部分:柔性衬底上导电薄膜的弯曲试验方法(IEC 47/2224/CD:2015)
2015-06-01
现行
BS IEC 60747-5-4-2022
Semiconductor devices-Optoelectronic devices. Semiconductor lasers
半导体器件.光电器件 半导体雷射
2022-06-20
现行
BS IEC 60747-14-4-2011
Semiconductor devices. Discrete devices-Semiconductor accelerometers
半导体器件 分立器件
2011-02-28