MIL MIL-STD-865E-选择性、刷镀、电沉积-国家数字标准馆

现行

MIL MIL-STD-868B

NICKEL PLATING, LOW EMBRITTLEMENT, ELECTRO-DESPOSITION(SUPERSEDING MIL-STD-868A)
镀镍低脆电沉积（取代MIL-STD-868A）

2007-03-01

现行

SAE AMS2439A

Selective (Brush) Nickel Plating Low-Stressed, Hard Deposit
选择性（电刷）镀镍低应力硬镀层

2000-10-01

现行

CID A-A-59460

PLATING UNIT, SELECTIVE (BRUSH), PORTABLE (SUPERSEDING MIL-P-80249A)
便携式选择性（刷式）电镀装置（取代MIL-P-80249A）

2000-06-12

现行

SAE AMS2441A

Selective (Brush) Nickel Plating Low-Stressed, Low Hardness Deposit
选择性（电刷）镀镍低应力、低硬度镀层

2000-10-01

现行

MIL MIL-P-80249A Notice 2-Cancellation

PLATING UNIT, SELECTIVE (BRUSH), PORTABLE (SUPERSEDING MIL-P-80249) (S/S BY A-A-59460)
便携式选择性（刷）电镀装置（取代MIL-P-80249）（由A-A-59460提供）

2000-06-12

现行

MIL MIL-P-80249A Notice 1-Validation

PLATING UNIT, SELECTIVE (BRUSH), PORTABLE (SUPERSEDING MIL-P-80249) (S/S BY A-A-59460)
便携式选择性（电刷）电镀装置（取代MIL-P-80249）（S/S由A-A-59460提供）

1987-03-17

现行

MIL MIL-STD-865C Notice 1-Inactivation

SELECTIVE (BRUSH PLATING), ELECTRODEPOSITION (SUPERSEDING MIL-STD-865B)(S/S BY MIL-STD-865D)
选择性（刷镀）、电沉积（取代MIL-STD-865B）

1996-12-09

现行

MIL MIL-P-47184A

PLATING, NICKEL-TUNGSTEN, ELECTRODEPOSIT ON ALUMINUM ALLOYS, BY SELECTIVE (BRUSH) METHOD (NO S/S DOCUMENT) (SUPERSEDING MIL-P-47184)
用选择性（刷）法在铝合金上电沉积镍钨镀层（无S/S文件）（代替MIL-P-47184）

1990-12-12

现行

MIL MIL-P-47184A Notice 1-Cancellation

PLATING, NICKEL-TUNGSTEN, ELECTRODEPOSIT ON ALUMINUM ALLOYS, BY SELECTIVE (BRUSH) METHOD (NO S/S DOCUMENT) (SUPERSEDING MIL-P-47184)
用选择性（刷）法在铝合金上电沉积镍钨镀层（无S/S文件）（代替MIL-P-47184）

1995-11-03