首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 IPC J-STD-001H
到馆提醒
收藏跟踪
购买正版
Requirements for Soldered Electrical and Electronic Assemblies 焊接电气和电子组件的要求
发布日期: 2020-09-01
J-STD-001是全球公认的焊接工艺和材料标准。来自18个国家的参与者提供了意见和专业知识,本文件为业界带来了最新的标准和新的图形,以便于使用和理解。对于电子行业中对电气和电子组件的工艺和验收标准感兴趣的人来说,这是必须具备的。J-STD-001与IPC-A-610协同开发,并由IPC-HDBK-001支持,以满足需要更多信息和说明的需求。
J-STD-001 is recognized globally for its criteria on soldering processes and materials. Updated with participants from 18 countries providing input and expertise, this document brings the latest criteria along with new graphics to the industry for ease of use and comprehension. This is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. J-STD-001 is developed in synergy with IPC-A-610 and is supported by IPC-HDBK-001 for those wanting additional information and explanation on the requirements.
分类信息
关联关系
研制信息
相似标准/计划/法规
现行
BS EN 61192-5-2007
Workmanship requirements for soldered electric assemblies-Rework, modification and repair of soldered electronic assemblies
焊接电气组件的工艺要求
2007-07-31
现行
BS EN 61192-4-2003
Workmanship requirements for soldered electronic assemblies-Terminal assemblies
焊接电子组件的工艺要求
2003-06-30
现行
KS C IEC 61192-5(2017 Confirm)
납땜된 전자조립품에 대한 작업 요구사항-제5부:납땜된 전자조립품의 재작업,보정 및 수리
焊接电子组件工艺要求第5部分:焊接电子组件的返工、修改和修理
2012-11-19
现行
KS C IEC 61192-5(2022 Confirm)
납땜된 전자조립품에 대한 작업 요구사항-제5부:납땜된 전자조립품의 재작업,보정 및 수리
焊接电子组件的工艺要求第5部分:焊接电子组件返工、修改和修理
2012-11-19
现行
BS EN 61192-1-2003
Workmanship requirements for soldered electronic assemblies-General
焊接电子组件的工艺要求
2003-06-26
现行
BS EN 61192-2-2003
Workmanship requirements for soldered electronic assemblies-Surface-mount assemblies
焊接电子组件的工艺要求
2003-06-25
现行
MIL MIL-HDBK-2000 Notice 1-Cancellation
SOLDERING OF ELECTRICAL AND ELECTRONIC ASSEMBLIES (NO S/S DOCUMENT)
电气和电子组件的焊接(无S/S文件)
1995-09-06
现行
MIL MIL-HDBK-2000
SOLDERING OF ELECTRICAL AND ELECTRONIC ASSEMBLIES (NO S/S DOCUMENT)
电气和电子组件的焊接(无S/S文件)
1990-07-04
现行
GB/T 31476-2015
电子装联高质量内部互连用焊料
Requirements for solders for high-quality interconnections in electronics assembly
2015-05-15
现行
BS EN 61192-3-2003
Workmanship requirements for soldered electronic assemblies-Through-hole mount assemblies
焊接电子组件的工艺要求
2003-04-07
现行
KS C IEC 61192-4(2017 Confirm)
납땜된 전자조립품에 대한 기량 요구사항-제4부:단자 조립품
焊接电子组件工艺要求第4部分:端子组件
2007-11-29
现行
KS C IEC 61192-4(2022 Confirm)
납땜된 전자조립품에 대한 기량 요구사항-제4부:단자 조립품
焊接电子组件的工艺要求第4部分:端子组件
2007-11-29
现行
GOST R IEC 61192-4-2010
Печатные узлы. Требования к качеству. Часть 4. Монтаж контактов
焊接电子组件 做工要求端子组件
现行
BS EN 61190-1-1-2002
Attachment materials for electronic assembly-Requirements for soldering fluxes for high-quality interconnections in electronics assembly
电子组装用附件材料
2002-08-16
现行
BS EN 61190-1-2-2014
Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly
电子组装用附件材料
2014-06-30
现行
BS EN IEC 61191-1-2018
Printed board assemblies-Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件
2018-11-13
现行
GB/T 31475-2015
电子装联高质量内部互连用焊锡膏
Requirements for solder paste for high-quality interconnections in electronics assembly
2015-05-15
现行
GB/T 43021-2023
电子组装件焊接的返工、改装和返修工艺要求
Workmanship requirements for rework, modification and repair of soldered electronic assemblies
2023-09-07
现行
GOST R IEC 61192-1-2010
Печатные узлы. Требования к качеству. Часть 1. Общие технические требования
焊接电子组件 做工要求第一部分一般技术要求
现行
IEC 61190-1-3-2017
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
电子组装用附件材料 - 第1-3部分:电子级焊料合金以及用于电子焊接应用的助焊剂和非助焊剂固体焊剂的要求
2017-12-13