IEC 62047-38:2021(E)规定了一种测试方法，用于测量微机电系统(MEMS)和电路板之间的电互连中金属粉末糊的粘附强度。金属粉末浆料的典型实例是各向异性导电浆料、焊料浆料和纳米级金属油墨。该测试方法适用于直径为10 μ m至500 μ m的金属粉末。 在该测试方法中，使用模拟实际MEMS器件的玻璃透镜对金属粉末浆料施加单轴压缩载荷；然后，通过使透镜退避来测定粘合强度。当应通过考虑MEMS器件与金属粉末颗粒之间的实际接触面积来分析粘附强度时，该测试方法是合适的。

IEC 62047-38:2021(E) specifies a test method for measuring the adhesion strength of metal powder paste in the electrical interconnection between micro-electromechanical systems (MEMS) and a circuit board. The typical examples of metal powder paste are anisotropic conductive paste, solder paste, and nanoscale metallic inks. This testing method is valid for metal powder diameters from 10 μm and 500 μm.
In this test method, a uniaxial compression load is applied to metal powder paste using a glass lens simulating an actual MEMS device; then, the adhesion strength is measured by retracting the lens. This test method is proper when the adhesion strength should be analyzed by considering the actual contact area between the MEMS device and metal powder particles.