首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
作废 SJ/T 10414-1993
到馆阅读
收藏跟踪
购买正版
半导体器件用焊料
发布日期: 1993-12-17
实施日期: 1994-06-01
分类信息
关联关系
研制信息
相似标准/计划/法规
现行
SJ/T 10414-2015
半导体器件用焊料
Solder for semiconductor device
2015-10-10
现行
BS EN IEC 62969-3-2018
Semiconductor devices. Semiconductor interface for automotive vehicles-Shock driven piezoelectric energy harvesting for automotive vehicle sensors
半导体器件 汽车用半导体接口
2018-06-28
现行
BS EN IEC 62969-4-2018
Semiconductor devices. Semiconductor interface for automotive vehicles-Evaluation method of data interface for automotive vehicle sensors
半导体器件 汽车用半导体接口
2018-08-30
现行
BS EN IEC 62969-2-2018
Semiconductor devices. Semiconductor interface for automotive vehicles-Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
半导体器件 汽车用半导体接口
2018-05-02
现行
BS EN IEC 62969-1-2018
Semiconductor devices. Semiconductor interface for automotive vehicles-General requirements of power interface for automotive vehicle sensors
半导体器件 汽车用半导体接口
2018-02-22
现行
JB/T 10097-2000
电力半导体器件用管壳
2000-04-24
现行
SJ/T 10535-1994
半导体器件用钨舟
Tungsten boat for semiconductor devices
1994-08-08
现行
BS IEC 62951-2-2019
Semiconductor devices. Flexible and stretchable semiconductor devices-Evaluation method for electron mobility, sub-threshold swing, and threshold voltage of flexible devices
半导体器件 柔性可伸缩半导体器件
2019-04-30
现行
BS IEC 60747-5-4-2022
Semiconductor devices-Optoelectronic devices. Semiconductor lasers
半导体器件.光电器件 半导体雷射
2022-06-20
现行
BS IEC 62951-5-2019
Semiconductor devices. Flexible and stretchable semiconductor devices-Test method for thermal characteristics of flexible materials
半导体器件 柔性可伸缩半导体器件
2019-03-05
现行
BS IEC 62951-4-2019
Semiconductor devices. Flexible and stretchable semiconductor devices-Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
半导体器件 柔性可伸缩半导体器件
2019-03-05
现行
BS IEC 62951-6-2019
Semiconductor devices. Flexible and stretchable semiconductor devices-Test method for sheet resistance of flexible conducting films
半导体器件 柔性可伸缩半导体器件
2019-05-15
现行
BS IEC 62951-7-2019
Semiconductor devices. Flexible and stretchable semiconductor devices-Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
半导体器件 柔性可伸缩半导体器件
2019-03-06
现行
MIL DESC 84002
HEAT SINKS FOR SEMICONDUCTOR DEVICES
半导体器件用散热器
1984-04-03
现行
BS EN 62007-2-2009
Semiconductor optoelectronic devices for fibre optic system applications-Measuring methods
光纤系统用半导体光电器件
2009-10-31
现行
JB/T 7061-1993
电力半导体器件用硅圆片
1993-10-08
现行
JB/T 7621-1994
电力半导体器件工艺用高纯水
1994-12-09
现行
JB 5842-1991
电力半导体器件用管芯定位环
1991-10-24
现行
JB 5843-1991
电力半导体器件用接插件
1991-10-24
现行
JB/T 9687.1-1999
电力半导体器件用钼圆片
1999-08-06