本规范旨在详细介绍“污染敏感硬件”热真空烘烤所需的试验要求和程序。本规范中定义的这些要求和程序提供了实现组件、子系统和完全组装系统的可接受分子排气水平的方法；以及验证这些水平已经达到。本文件通常遵循ASTM E2900热真空烘烤方法C，使用光学见证样品代替或添加非挥发性残留物（NVR）见证板。

The purpose of this specification is to present in detail the test requirement and procedures necessary for the thermal vacuum bakeout of "contamination sensitive hardware". These requirements and procedures as defined within this specification provide the methodology to achieve an acceptable level of molecular outgassing from components, subsystems, and totally assembled systems; and the verification that these levels have been achieved. This document generally follows the ASTM E2900 method for thermal vacuum bakeout, method C, with optical witness sample(s) in lieu of or in addition to nonvolatile residue (NVR) witness plates.