1.1 本试验方法涵盖了使用电感耦合等离子体原子发射光谱法（ICP-AES）仪器分析锡基焊料合金中微量元素的程序。 1.2 这些测试程序针对以下列出的分析物和质量分数进行了验证。 要素 验证质量分数 范围，mg/kg 领导 115至965 镉 25至60 水星 5至530 锑 85至1330 铋 80至210 砷 95至360 银 4000至42100 钴 0.5至60 铁 15至115 铬 0.5至1.5 铜 3000至30600 铟 25至115 镍 5至150 磷 10至110 硒 1至30 锌 2至160 铝 1到3 1.3 程序按以下顺序出现: 程序 部分 内部标准化 8. 校准溶液制备 9 样品和验证溶液的制备 10 标定 11 分析程序 12 1.4 以国际单位制表示的数值应视为标准。 任何其他值仅供参考。 1.5 本标准并非旨在解决与其使用相关的所有安全问题（如有）。本标准的用户有责任在使用前制定适当的安全和健康实践，并确定监管限制的适用性。 ====意义和用途====== 4.1 锡基焊料合金通常用于制造电气和电子产品。铅、镉、汞、锑和铋元素通常是焊料材料中的申报物质。本试验方法提供了一种测定锡基焊料合金中列出的可申报物质以及其他微量成分的方法。 4.2 本标准给出了两种溶解锡基焊料合金的方法。第一种方法使用敞口容器氢氟酸和硝酸室温消解； 第二种方法采用密闭容器硝酸和氢氟酸微波消解，两者均仅用于配备耐氢氟酸样品引入系统的ICP-AES仪器。 4.3 制备校准溶液的方法使用1000 mg/kg的单元素标准物质溶液，并对校准溶液和样品溶液使用匹配的浓酸。 4.4 本试验方法适用于具有ICP-AES样品设置、校准和分析经验的实验室。

1.1 This test method covers procedures for the analysis of tin-based solder alloys for minor and trace elements using inductively-coupled plasma atomic emission spectrometry (ICP-AES) instrumentation. 1.2 These test procedures were validated for the analytes and mass fractions listed below. Element Validated Mass Fraction Range, mg/kg Lead 115 to 965 Cadmium 25 to 60 Mercury 5 to 530 Antimony 85 to 1330 Bismuth 80 to 210 Arsenic 95 to 360 Silver 4000 to 42100 Cobalt 0.5 to 60 Iron 15 to 115 Chromium 0.5 to 1.5 Copper 3000 to 30600 Indium 25 to 115 Nickel 5 to 150 Phosphorus 10 to 110 Selenium 1 to 30 Zinc 2 to 160 Aluminum 1 to 3 1.3 The procedures appear in the following order: Procedure Section Internal Standardization 8 Calibration Solution Preparations 9 Preparation of Sample and Validation Solutions 10 Calibration 11 Analysis Procedure 12 1.4 The values stated in SI units are to be regarded as the standard. Any other values are for information only. 1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. ====== Significance And Use ====== 4.1 Tin-based solder alloys are commonly used to manufacture electrical and electronic goods. The elements lead, cadmium, mercury, antimony and bismuth are often declarable substances in solder materials. This test method provides a means of determining the listed declarable substances, as well as other minor and trace constituents, in tin-based solder alloys. 4.2 Two methods of dissolving tin-based solder alloys are given in this standard. The first method uses open-vessel hydrofluoric and nitric acid room temperature digestions; the second method employs closed-vessel nitric and hydrofluoric acid microwave digestions, both for use only with ICP-AES instruments equipped with a hydrofluoric acid resistant sample introduction system. 4.3 The method of preparing calibration solutions uses 1000 mg/kg single element reference material solutions, and uses matching concentrated acids for both the calibration solutions and the sample solutions. 4.4 This test method is intended for use by laboratories experienced with the set-up, calibration and analysis of samples using ICP-AES.