IEC 62483:2013描述了适用于锡基表面光洁度环境验收测试的方法以及半导体器件上锡晶须的缓解措施。这种方法可能不足以用于具有特殊要求的应用（即军事、航空航天等）。其他要求可在适当的要求（采购）文件中指定。第一版基于JEDEC文件JESD201A和JESD22-A121A，取代了2006年发布的IEC/PAS 62483。这第一版构成了技术修订。与上一版相比，此版本包括以下重大技术变更: a）将IEC/PAS 62483的内容添加到JESD201A的内容中，作为附录A。 b)介绍了锡基表面处理的环境验收测试方法和锡晶须的缓解措施。 c)引入了第6条，详细说明了测试结果的报告要求。

IEC 62483:2013 describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation. This first edition is based on JEDEC documents JESD201A and JESD22-A121A and replaces IEC/PAS 62483, published in 2006. This first edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) The content of IEC/PAS 62483 was added to the content of JESD201A as Annex A.
b) A methodology was introduced for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers.
c) A Clause 6 was introduced detailing the reporting requirements of test results.