IEC 60286-3:20 22适用于不带引线或带引线残端的电子元件的胶带封装，旨在连接到电子电路。它仅包括用于上述目的的部件的胶带所必需的那些尺寸。本文件还包括与包括裸芯片和凸块芯片（倒装芯片）在内的单片芯片产品的封装相关的要求。与上一版相比，此版本包括以下重大技术变更: 加法术语和定义。 将分类表添加到与驱动孔直径和卷轴孔中心与驱动孔中心之间的距离有关的符号中； 在卷轴上增加驱动孔（可选）； 卷筒孔直径公差的修订； 修订72 mm胶带尺寸载带宽度尺寸公差； 增加附件B（资料性）； 增加组件尺寸0201M。

IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:

1. addition terms and definitions.
2. addition of a table of the classification to symbols concerning drive hole diameter and distance between the reel hole centre and the drive hole centre;
3. addition of drive hole to the reel (optional);
4. revision of reel hole diameter tolerances;
5. revision of 72 mm tape size carrier tape width dimension tolerances;
6. addition of Annex B (informative);
7. addition of component size 0201M.