IEC 60384-19:20 22适用于电子设备中使用的带有金属化电极和聚对苯二甲酸乙二醇酯电介质的直流固定表面贴装电容器。这些电容器具有金属化的连接垫或焊带，并且旨在直接安装到印刷电路板上或用于混合电路的衬底上。根据使用条件，这些电容器可以具有“自愈特性”。它们主要用于交流分量相对于额定电压较小的应用。 IEC 60384的这一部分规定了首选的额定值和特性，并从IEC 60384？1:20 21适当的质量评估程序、测试和测量方法，并给出了此类电容器的一般性能要求。参考本部分规范的详细规范中规定的试验严重性和要求具有相同或更高的性能水平。不允许较低的性能水平。 用于抑制电磁干扰的电容器不包括在内，但在IEC 60384？14. 与上一版相比，此版本包括以下重大技术变更: 根据ISO/IEC指令第2部分:2021修订文件的所有部分，并与其他类似类型的文件协调一致； 文件结构的组织遵循TC 40中决定的新的部分规范结构； 修订了表格和第5条，以防止重复和矛盾； 在第5.2条（安装）中，增加了5.2.1、5.2.2和5.2.3； 在第5条中。增加了5（剪切试验）、5.5.1和5.5.2； 在条款5.14（组分耐溶剂性）中，增加了5.14.1和5.14.2。在表8和表A.2中，在组1A和亚组C1中，试验5.14已移至5.7.5最终检查之前； 在第5.15条（标记的耐溶剂性）中，增加了5.15.1和5.15.2； 在耐焊热试验中增加了损耗角正切测量； 包括要求在内的逐批和定期检查表已移至附录A； 修订了A1亚组的检查水平（IL）。

IEC 60384-19:2022 is applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly onto printed boards or onto substrates for hybrid circuits. These capacitors can have "self-healing properties" depending on conditions of use. They are primarily intended for applications where the AC component is small with respect to the rated voltage.
This part of IEC 60384 specifies preferred ratings and characteristics, and selects from IEC 60384？1:2021 the appropriate quality assessment procedures, tests and measuring methods, and gives general performance requirements for this type of capacitor. Test severities and requirements specified in detail specifications referring to this sectional specification are of an equal or higher performance level. Lower performance levels are not permitted.
Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384？14.
This edition includes the following significant technical changes with respect to the previous edition:

1. revision of all parts of the document based on the ISO/IEC Directives, Part 2:2021, and harmonization with other similar kinds of documents;
2. the document structure has been organized to follow new sectional specification structure decided in TC 40;
3. revised tables and Clause 5 to prevent duplications and contradictions;
4. in Clause 5.2 (Mounting), 5.2.1, 5.2.2 and 5.2.3 have been added;
5. in Clause 5.5 (Shear test), 5.5.1 and 5.5.2 have been added;
6. in Clause 5.14 (Component solvent resistance), 5.14.1 and 5.14.2 have been added. In Table 8 and Table A.2, test 5.14 has been moved before 5.7.5 Final inspections in Group 1A and in Subgroup C1;
7. in Clause 5.15 (Solvent resistance of marking), 5.15.1 and 5.15.2 have been added;
8. tangent of loss angle measurement has been added to resistance to soldering heat test;
9. lot-by-lot and periodical inspection tables including requirements have been moved to Annex A;
10. revised Inspection Level (IL) of A1 subgroup.