ECA/EIA 402-液态松香焊剂-国家数字标准馆

现行

MIL MIL-F-14256E Amendment 1

FLUX, SOLDERING, LIQUID (ROSIN BASE) (S/S BY MIL-F-14256F) (SUPERSEDING MIL-F-14256D)
液体助焊剂（松香基）（由MIL-F-14256F提供）（取代MIL-F-14256D）

1990-07-21

现行

SJ/T 11273-2016

免清洗液态助焊剂
No-clean liquid flux

2016-04-05

现行

CID A-A-51145D

FLUX, SOLDERING, NON-ELECTRONIC, PASTE AND LIQUID (SUPERSEDING A-A-51145C)
非电子焊剂、锡膏和液体（替代A-A-51145C）

2001-07-27

现行

CID A-A-51145D

FLUX, SOLDERING, NON-ELECTRONIC, PASTE AND LIQUID (SUPERSEDING A-A-51145C)
非电子焊剂、锡膏和液体（替代A-A-51145C）

2001-07-27

现行

ASTM B813-24

Standard Specification for Water Flushable Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube
铜和铜合金管焊接用水冲洗液体和糊状焊剂的标准规范

2024-07-01

现行

ASTM D6141-18(2022)

Standard Guide for Screening Clay Portion and Index Flux of Geosynthetic Clay Liner (GCL) for Chemical Compatibility to Liquids
与液体化学相容性用土工合成粘土衬里（GCL）的粘土部分和指数通量筛选指南

2022-10-01

现行

AWWA MTC53899

Evaluation and Optimization of an Immersed Membrane Filtration System for Liquid-Solid Separation: Effect of Hydrodynamic Conditions on Fouling and Critical Flux
液固分离浸没式膜过滤系统的评价与优化:水动力条件对污垢和临界通量的影响

2001-05-01

现行

QPL QPL-14256-88

FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING QPL-14256-87)
助焊剂焊接液体焊膏助焊剂焊膏和焊膏助焊剂（电子/电气用）通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995 ANSI/J-STD-006-1995-1995 取代QPL-14256-87）

1995-03-31

现行

QPL QPL-14256-88

FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING QPL-14256-87)
助焊剂焊接液体焊膏助焊剂焊膏和焊膏助焊剂（电子/电气用）通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995 ANSI/J-STD-006-1995-1995 取代QPL-14256-87）

1995-03-31

现行

MIL MIL-F-14256F Notice 1-Cancellation

FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING MIL-F-14256E)
焊剂液体膏状焊剂焊膏和焊料膏状焊剂（电子/电气用）通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995和ANSI/J-STD--006-1995-1995）（代替MIL-F-14256E）

1995-06-15

现行

MIL MIL-F-14256F Amendment 1

FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING MIL-F-14256E)
焊剂液体膏状焊剂焊膏和焊料膏状焊剂（电子/电气用）通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995和ANSI/J-STD--006-1995-1995）（代替MIL-F-14256E）

1994-05-18

现行

MIL MIL-F-14256F

FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING MIL-F-14256E)
助焊剂焊接液体焊膏助焊剂焊膏和焊膏助焊剂（电子/电气用）通用规范（由ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995 ANSI/J-STD-006-1995-1995代替MIL-F-14256E）

1993-04-26