本出版物规定了在非循环电路板组装和测试操作期间，确定电路板级设备互连抗弯曲载荷断裂能力的常用方法。每个设备的合格/不合格要求通常不在本文件的适用范围内。

This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/fail requirements are typically specific to each device application and are outside the scope of this document.