本文件描述了受IPC-9501、IPC-9504和J-STD-020约束的部件的制造焊接工艺限制。它不包括装配的最佳条件，而是确保部件不受损的指南。本文件适用于波焊、回流焊或手工焊接的表面贴装（SM）和通孔（TH）组件。本文件旨在补充其他行业文件。注:本文件不涉及无铅焊料的升温要求。

This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.