Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
表面安装技术.第2部分:表面安装装置（SMD）的运输和储存条件.应用指南

2021-07-16

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
表面安装技术 - 第2部分:表面安装器件（SMD）的运输和存储条件 - 应用指南

2021-07-16

표면실장기술－제2부：표면실장부품(SMD)의 운송과 보관조건－적용가이드
表面安装技术第2部分:表面安装器件（SMD）的运输和储存条件应用指南

2009-12-01

IEC 61760-2. Surface mounting technology. Part 2. Transportation and storage conditions of surface mounting devices (SMD). Application guide
IEC 61760-2 表面安装技术 第二部分 表面安装装置（SMD）的运输和储存条件 申请指南

2005-12-09

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 61760-2:2007); German version EN 61760-2:2007
表面安装技术.第2部分:表面安装装置（SMD）的运输和储存条件.应用指南（IEC 61760-2-2007）；德文版EN 61760-2:2007

2007-10-01

Draft Document - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 91/1631/CD:2019); Text in German and English
起草文件-表面安装技术-第2部分:表面安装设备（SMD）的运输和储存条件-应用指南（IEC 91/1631/CD:2019）；德语和英语文本

2020-11-01