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Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave) 大规模焊接工艺(回流焊和波峰焊)的温度分布指南
发布日期: 2017-02-28
IPC 7530A为开发热剖面以生产可接受的SnPb和无铅电子组件提供了有用且实用的信息。本次修订将原标准的重点从回流焊轮廓扩展到包括气相、激光、选择性焊接和波峰焊接轮廓。修订版还包括一个全彩故障排除指南,用于解决可归因于分析的常见缺陷。
IPC 7530A provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common defects which can be attributed to profiling.
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