1.1本规程涵盖了真菌对模制和预制制品、管、杆、片和薄膜材料形式的合成聚合物材料性能影响的测定。光学、机械和电气性能的变化可通过适用的ASTM方法确定。 1.2以国际单位制表示的数值应视为标准。括号中的英寸-磅单位仅供参考。 1.3 本标准并非旨在解决与其使用相关的所有安全问题（如有）。本标准的用户有责任在使用前制定适当的安全和健康实践，并确定监管限制的适用性。 ====意义和用途====== 这些材料的合成聚合物部分通常具有抗真菌性，因为它不作为真菌生长的碳源。 通常是其他成分，如增塑剂、纤维素、润滑剂、稳定剂和着色剂，导致真菌对塑料材料的侵蚀。重要的是，在有利于微生物攻击的条件下，即2到38℃的温度下，建立对微生物攻击的抗性 ° C（35至100 ° F） 相对湿度为60%-100%。 预期效果如下: 4.2.1表面侵蚀、变色、传输损失（光学），以及 4.2.2去除易受影响的增塑剂、改性剂和润滑剂，导致模量（刚度）增加、重量、尺寸和其他物理性能变化，以及电气性能（如绝缘电阻、介电常数、功率因数和介电强度）恶化。 通常，电性能的变化主要是由于表面生长及其相关的水分，以及由排泄的代谢产物引起的pH值变化。 其他影响包括增塑剂、润滑剂和其他加工添加剂的不均匀分散引起的优先生长。对这些材料的攻击通常会留下电离导电路径。在薄膜形式或涂层形式的产品上观察到明显的物理变化，其中表面与体积的比率很高，并且营养物质（如增塑剂和润滑剂）在被生物体利用时继续扩散到表面。 由于局部加速和抑制，生物体的攻击涉及很大的机会因素，因此再现性的顺序可能相当低。为了确保对行为的估计不太乐观，应报告观察到的最大恶化程度。 样本的处理，例如暴露于浸出、风化、热处理等，可能对真菌的抗性有显著影响。本规程不包括这些影响的确定。

1.1 This practice covers determination of the effect of fungi on the properties of synthetic polymeric materials in the form of molded and fabricated articles, tubes, rods, sheets, and film materials. Changes in optical, mechanical, and electrical properties may be determined by the applicable ASTM methods. 1.2 The values stated in SI units are to be regarded as the standard. The inch-pound units given in parentheses are for information only. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. ====== Significance And Use ====== The synthetic polymer portion of these materials is usually fungus-resistant in that it does not serve as a carbon source for the growth of fungi. It is generally the other components, such as plasticizers, cellulosics, lubricants, stabilizers, and colorants, that are responsible for fungus attack on plastic materials. It is important to establish the resistance to microbial attack under conditions favorable for such attack, namely, a temperature of 2 to 38 ° C (35 to 100 ° F) and a relative humidity of 60 to 100 %. The effects to be expected are as follows: 4.2.1 Surface attack, discoloration, loss of transmission (optical), and 4.2.2 Removal of susceptible plasticizers, modifiers, and lubricants, resulting in increased modulus (stiffness), changes in weight, dimensions, and other physical properties, and deterioration of electrical properties such as insulation resistance, dielectric constant, power factor, and dielectric strength. Often the changes in electrical properties are due principally to surface growth and its associated moisture and to pH changes caused by excreted metabolic products. Other effects include preferential growths caused by nonuniform dispersion of plasticizers, lubricants, and other processing additives. Attack on these materials often leaves ionized conducting paths. Pronounced physical changes are observed on products in film form or as coatings, where the ratio of surface to volume is high, and where nutrient materials such as plasticizers and lubricants continue to diffuse to the surface as they are utilized by the organisms. Since attack by organisms involves a large element of chance due to local accelerations and inhibitions, the order of reproducibility may be rather low. To ensure that estimates of behavior are not too optimistic, the greatest observed degree of deterioration should be reported. Conditioning of the specimens, such as exposure to leaching, weathering, heat treatment, etc., may have significant effects on the resistance to fungi. Determination of these effects is not covered in this practice.