本标准规定了手动焊接，高可靠性电气连接的制造和验证的技术要求和质量保证条款。该标准定义了用于承受正常地面条件的手动焊接电气连接的高可靠性制造的接受和拒绝标准以及由太空飞行施加的振动g载荷和环境。本文档涵盖了正确的工具，正确的材料，设计和工艺。包括工艺标准，以便在适当和不正当的工作之间进行歧视。 ECSS-Q-ST-70-38涵盖了表面贴装器件的组装。有关印刷电路板的要求包含在ECSS-Q-ST-70-10和ECSS-Q-ST-70-11中。在本标准中未描述的手动焊接组件的验证是通过振动和热循环测试进行的。验证要求见本标准。本标准不包括手动焊接连接的EQM和FM设备的资格和验收。符合本标准制造的设备的认证和验收测试由ECSS-E-ST-10-03涵盖。组件，端子和配件的安装和支撑

This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, high-reliability electrical connections. The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38. Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10 and ECSS-Q-ST-70-11. Verification of manual soldering assemblies which are not described in this standard are performed by vibration and thermal cycling testing. The requirements for verification are given in this Standard. This standard does not cover the qualification and acceptance of EQM and FM equipment with hand soldered connections. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03. The mounting and supporting of components, terminals and conductors prescribed herein applies to assemblies designed to operate within the temperature limits of -55 °C to +85 °C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 °C, power transistors) in order to ensure that solder joints do not exceed 85 °C. This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS-S-ST-00.