首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 SJ/T 11519-2015
到馆阅读
收藏跟踪
购买正版
电子连接用镀锡铜线规范 Specification for tinned copper wire of electronic connection used
发布日期: 2015-04-30
实施日期: 2015-10-01
分类信息
关联关系
研制信息
相似标准/计划/法规
现行
ASTM B973-10(2020)e1
Standard Specification for Tin-Coated Braid and Ribbon Flat Copper Wire intended for use in Electronic Application
用于电子应用的镀锡编织带和扁平铜线的标准规格
2020-01-01
现行
ASTM B520-12(2023)
Standard Specification for Tin-Coated, Copper-Clad Steel Wire for Electronic Application
电子设备用镀锡覆铜钢丝标准规范
2023-10-01
现行
ASTM B943-16(2022)
Standard Specification for Zinc and Tin Alloy Wire Used in Thermal Spraying for Electronic Applications
电子设备用热喷涂用锌和锡合金线的标准规范
2022-04-01
现行
ASTM B286-20
Standard Specification for Copper Conductors for Use in Hookup Wire for Electronic Equipment
用于电子设备连接线的铜导体标准规范
2020-11-01
现行
SJ 20716-1998
电子元器件用铍青铜线棒材规范
Specification for copper-beryllium alloy wire and bor for use in electronic components
1998-03-18
现行
ASTM B965-09(2018)
Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability
用于电气和电子应用可焊性的高性能镀锡退火铜丝的标准规范
2018-10-01
现行
ASTM B470-02(2024)
Standard Specification for Bonded Copper Conductors for Use in Hookup Wires for Electronic Equipment
用于电子设备连接线的粘合铜导体的标准规范
2024-10-01
现行
NASA GSFC S-311-P-13/1
WIRE, ELECTRICAL, RADIATION CROSSLINKED POLYALKENE INSULATED, TIN-COATED COPPER, 600 VOLT, FOR SPAE FLIGHT USE DETAIL SPECIFICATION FOR
SPAE飞行用600伏辐射交联聚烯烃绝缘镀锡铜电线详细规范
1990-05-01
现行
NASA GSFC S-311-P-13/2
WIRE, ELECTRICAL, RADIATION CROSSLINKED POLYALKENE INSULATED, TIN-COATED COPPER, 1000 VOLT, FOR SPACE FLIGHT USE, DETAIL SPECIFICATION FOR
航天用1000伏辐射交联聚烯烃绝缘镀锡铜电线详细规范
1990-05-01
现行
ASTM B971-10(2020)e1
Standard Specification for Silver-Coated Braid and Ribbon Flat Copper Wire intended for use in Electronic Application
用于电子应用的镀银辫子和丝带扁铜线的标准规格
2020-01-01
现行
ASTM B972-10(2020)e1
Standard Specification for Nickel-Coated Braid and Ribbon Flat Copper Wire Intended for use in Electronic Application
用于电子应用的镀镍编织带和扁平铜丝的标准规格
2020-01-01
现行
BS 4584-103.2-1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for copper foil for use in the manufacture of copper-clad base materials
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 覆铜基材制造用铜箔规范
1990-02-28