BS EN 62047-25:2016规定了测量混凝土粘结强度的现场试验方法 微键合区是利用硅基材料中的微机械加工技术制作的 微机电系统（MEMS）。本文件适用于混凝土的现场拉压和抗剪强度测量 采用微电子技术和其他工艺制作的微键合区 微加工技术。微锚通过微粘合区域固定在基板上，提供机械连接 支持MEMS设备中的可移动传感/驱动功能部件。和 器件结垢、粘结强度降低，由缺陷、污染和 键合表面的热失配应力变得更加严重。本标准规定了现场测试 基于图形技术的拉压和剪切强度测试方法。本文件不需要复杂的仪器（如扫描探针显微镜和显微镜） 纳米压头），并专门准备试样。由于本标准中的测试结构可以作为一个整体植入设备制造中 标准检测模式，本文件可以提供一个桥梁，通过该桥梁进行制造 铸造厂可以为设计者提供一些定量的参考。交叉引用:IEC 62047-1EN 62047-1ISO 10012EN ISO 10012购买本文件时提供的所有现行修订版均包含在购买本文件中。

BS EN 62047-25:2016 specifies thein-situtesting method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS).This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.Micro anchor, fixed on the substrate through the micro bonding area, provides mechanical support of the movable sensing/actuating functional components in MEMS devices. With the devices scaling, the bonding strength degradation, induced by defects, contaminations and thermal mismatch stress on bonding surface, becomes severer.This standard specifies an insitu testing method of the pull-press and shearing strength based on a patterned technique.This document does not need intricate instruments (such as scanning probe microscopy and nanoindenter) and to prepare the test specimen specially.Since the testing structure in this standard can be implanted in device fabrication as a standard detection pattern, this document can provide a bridge, by which the fabrication foundry can give some quantitative reference for the designer.Cross References:IEC 62047-1EN 62047-1ISO 10012EN ISO 10012All current amendments available at time of purchase are included with the purchase of this document.