多层印制板用粘结片通用规则
General rules for bonding sheet for multilayer printed boards

2016-10-13

刚性多层印制板用粘结片规范
Specification for bonding sheet use in the fabrication rigid multilayer printed circuit boards

2016-01-19

多层印制板用粘结片试验方法
Test methods for bongding sheet for multilayer printed boards

2016-10-13

多层印制板用粘结片预浸材料

1996-04-14

多层印制板用粘结片加工贸易单耗标准

2016-07-25

多层印制板用环氧玻纤布粘结片预浸料
Prepreg used as bonding sheet for multilayer printed boards-Epoxy resin-impregnated glass cloth

2014-10-14

多层印制板用无卤环氧玻纤布粘结片预浸料

2013-08-01

多层印制板用氰酸酯改性环氧玻纤布粘结片预浸料
Prepreg used as bonding sheets for multilayer printed boards-Cyanate ester modified epoxy resin-impregnated glass cloth

2014-10-14

多层印制电路板用粘结片复验规则和方法

1999-04-02

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 多层印制板制造中用作粘合片材料的预浸料规范

1990-02-28

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板

2002-08-31

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印刷电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃织物覆铜层压板

2002-08-31