现行

IEC 62047-20-2014

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
半导体器件微机电器件第20部分:陀螺仪

2014-06-26

现行

BS EN 62047-1-2016

Semiconductor devices. Micro-electromechanical devices-Terms and definitions
半导体器件 微机电设备

2016-04-30

现行

BS EN 62047-19-2013

Semiconductor devices. Micro-electromechanical devices-Electronic compasses
半导体器件 微机电设备

2013-10-31

现行

BS IEC 62047-40-2021

Semiconductor devices. Micro-electromechanical devices-Test methods of micro-electromechanical inertial shock switch threshold
半导体器件 微机电设备

2021-09-14

现行

BS EN 62047-4-2010

Semiconductor devices. Micro-electromechanical devices-Generic specification for MEMS
半导体器件 微机电设备

2010-11-30

现行

BS EN 62047-5-2011

Semiconductor devices. Micro-electromechanical devices-RF MEMS switches
半导体器件 微机电设备

2013-04-30

现行

GB/T 32817-2016

半导体器件 微机电器件 MEMS总规范
Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS

2016-08-29

现行

BS EN 62047-10-2011

Semiconductor devices. Micro-electromechanical devices-Micro-pillar compression test for MEMS materials
半导体器件 微机电设备

2011-09-30

现行

BS IEC 62047-33-2019

Semiconductor devices. Micro-electromechanical devices-MEMS piezoresistive pressure-sensitive device
半导体器件 微机电设备

2019-04-18

现行

IEC 62047-1-2016

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
半导体器件 - 微机电器件 - 第1部分:术语和定义

2016-01-06

现行

IEC 62047-19-2013

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
半导体器件 - 微机电器件 - 第19部分:电子罗盘

2013-07-17

现行

GB/T 42709.19-2023

半导体器件 微电子机械器件 第19部分：电子罗盘
Semiconductor devices—Micro-electromechanical devices—Part 19: Electronic compasses

2023-08-06

现行

IEC 62047-40-2021

Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
半导体器件.微机电器件.第40部分:微机电惯性冲击开关阈值的试验方法

2021-09-03

现行

BS EN 62047-26-2016

Semiconductor devices. Micro-electromechanical devices-Description and measurement methods for micro trench and needle structures
半导体器件 微机电设备

2016-05-31

现行

DIN EN 62047-20

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
半导体器件.微机电器件.第20部分:陀螺仪（IEC 62047-20-2014）；德文版EN 62047-20:2014

2015-04-01

现行

IEC 62047-4-2008

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
半导体器件 - 微机电器件第4部分:Mems的通用规范

2008-08-21

现行

IEC 62047-5-2011

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
半导体器件 - 微机电器件 - 第5部分:RF MEMS开关

2011-07-13

现行

GB/T 41853-2022

半导体器件 微机电器件 晶圆间键合强度测量
Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement

2022-10-12

现行

GB/T 42709.5-2023

半导体器件 微电子机械器件 第5部分：射频MEMS开关
Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches

2023-05-23

现行

BS IEC 62047-35-2019

Semiconductor devices. Micro-electromechanical devices-Test method of electrical characteristics under bending deformation for flexible electromechanical devices
半导体器件 微机电设备

2021-04-20