组件是否与您的流程配合使用？这种确定是这些制造过程模拟的目标；确保所选组件在暴露于工厂工艺后满足预期的可靠性要求。本文件专门论述了部件的预处理。该程序是为用户和制造商开发的，包括一组模拟IC元件的存储和使用、波峰焊和回流焊（SMT和PTH零件）、腐蚀性（水溶性）焊剂的暴露和常用清洁材料的暴露。

Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials.