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现行 IEC TR 61191-7:2020
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Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies 印制板组件.第7部分:组件和印制板组件的技术清洁度
发布日期: 2020-03-11
IEC TR 61191-7:2020(E)作为一份技术报告,提供了如何在电子组装行业内评估技术清洁度的信息。技术清洁度涉及电子行业部件和电子组件上的颗粒物(所谓异物碎屑)的来源、分析、减少和控制以及相关风险。
IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.
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归口单位: TC 91
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