本标准规定了基于表面贴装（SMD）和混合技术的高可靠性电子电路的制造和验证的技术要求和质量保证条款。 该标准规定了高可靠性制造表面贴装和混合技术电路组件的接受和排除标准，旨在承受正常的地面条件和振动负荷以及太空飞行施加的环境。 本文档涵盖了正确的工具，正确的材料，设计和工艺。包括工艺标准，以便在适当和不正当的工作之间进行歧视。 含铅设备到通孔端子的组装和一般焊接原理在ECSS Q ST Q-70-08中有所介绍。 有关印刷电路板的要求包含在ECSS Q ST Q 70 10和ECSS Q ST Q-70-11中。本文件涵盖的基板根据其平均X和Y热膨胀系数（CTE）分为五类。 本文规定的部件，端子和导体的安装和支撑适用于设计为在-55℃，85℃，+ 85℃的温度范围内工作的组件。 对于超出正常范围的温度，特殊设计，veri

This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface mounted device (SMD) and mixed technology. The Standard defines acceptance and rejection criteria for high-reliability manufacture of surface-mount and mixed-technology circuit assemblies intended to withstand normal terrestrial conditions and the vibrational g loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of leaded devices to through-hole terminations and general soldering principles are covered in ECSS-Q-ST-70-08. Requirements related to printed circuit boards are contained in ECSS-Q-ST-70 10, ECSS-Q-ST-70-11 and ECSS-Q-ST-70-12. The mounting and supporting of devices, terminals and conductors prescribed herein applies to assemblies at PCB level designed to continuously operate over the mission within the temperature limits of -55 C to +85 C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 C, power transistors) in order to ensure that solder joints do not exceed 85 C. Verification of SMD assembly processes is made on test vehicles (surface mount verification samples). Temperature cycling ensures the operational lifetime for spacecraft. However, mechanical testing only indicates SMD reliability as it is unlikely that the test vehicle represents every flight configuration. This Standard does not cover the qualification and acceptance of the EQM and FM equipment with surface-mount and mixed-technology. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03. This standard may be tailored for the specific characteristics and constraints of a space project, in accordance with ECSS-S-ST-00.