现行

MIL MIL-R-83330

RESIN, HEAT-RESISTANT, LAMINATING (NO S/S DOCUMENT)
层压耐热树脂（无S/S文件）

1971-07-15

现行

MIL MIL-R-3745 Notice 1-Cancellation

RESIN, PHENOL-FORMALDEHYDE, LAMINATING (NO S/S DOCUMENT)
树脂 苯酚 - 甲醛 层压（无S/S文件）

1996-05-31

现行

MIL MIL-R-3745

RESIN, PHENOL-FORMALDEHYDE, LAMINATING (NO S/S DOCUMENT)
层压酚醛树脂（无S/S文件）

1952-04-30

现行

FED L-T-41A

TABLE TOP ASSEMBLIES (PLASTIC THERMOSETTING RESIN LAMINATE)(NO S/S DOCUMENT)
桌面组件（塑料热固性树脂层压板）（无S/S文件）

1953-07-16

现行

FED L-T-41A

TABLE TOP ASSEMBLIES (PLASTIC THERMOSETTING RESIN LAMINATE)(NO S/S DOCUMENT)
桌面组件（塑料热固性树脂层压板）（无S/S文件）

1953-07-16

现行

MIL MIL-R-9299C Notice 2-Cancellation

RESIN, PHENOLIC, LAMINATING (SUPERSEDING MIL-R-9299B) (NO S/S DOCUMENT)
层压酚醛树脂（取代MIL-R-9299B）（无S/S文件）

1998-11-24

现行

MIL MIL-R-9299C Notice 1-Validation

RESIN, PHENOLIC, LAMINATING (SUPERSEDING MIL-R-9299B) (NO S/S DOCUMENT)
层压酚醛树脂（取代MIL-R-9299B）（无S/S文件）

1991-10-24

现行

MIL MIL-R-9299C

RESIN, PHENOLIC, LAMINATING (SUPERSEDING MIL-R-9299B) (NO S/S DOCUMENT)
层压酚醛树脂（取代MIL-R-9299B）（无S/S文件）

1968-12-03

现行

FED L-T-0041C

TABLE TOP AND FURNITURE ASSEMBLIES (PLASTIC THERMOSETTING RESIN LAMINATE)(NO S/S DOCUMENT)
桌面和家具组件（塑料热固性树脂层压板）（无S/S文件）

1958-01-29

现行

FED L-T-0041C

TABLE TOP AND FURNITURE ASSEMBLIES (PLASTIC THERMOSETTING RESIN LAMINATE)(NO S/S DOCUMENT)
桌面和家具组件（塑料热固性树脂层压板）（无S/S文件）

1958-01-29

现行

MIL MIL-A-47282A

ADHESIVE, PASTE, HEAT RESISTANT (NO S/S DOCUMENT)
耐热胶粘剂 粘贴（无S/S文件）

1975-05-30

现行

MIL MIL-C-13695 Notice 1-Cancellation

CLOTH, COTTON, LAMINATED, WATERPROOF AND GASOLINE - AND GREASE - RESISTANT (NO S/S DOCUMENT)
布、棉、层压、防水、耐汽油和油脂（无S/S文件）

1976-01-05

现行

MIL MIL-S-13949/19A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/19) (NO S/S DOCUMENT)
片材 印刷线路板 层压 基材QI（编织石英增强 聚酰亚胺树脂 耐热 金属包覆或未包覆）（取代MIL-S-13949/19）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/19A Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/19) (NO S/S DOCUMENT)
片材 印刷线路板 层压 基材QI（编织石英增强 聚酰亚胺树脂 耐热 金属包覆或未包覆）（取代MIL-S-13949/19）（无S/S文件）

1998-11-30

现行

MIL MIL-S-13949/19A

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/19) (NO S/S DOCUMENT)
基材QI层压印刷线路板（编织石英增强、聚酰亚胺树脂、耐热、金属包覆或非包覆）（替代MIL-S-13949/19）（无S/S文件）

1993-12-06

现行

MIL MIL-S-13949/10C Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/10B) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GI（编织电子玻璃增强材料、聚酰亚胺树脂、耐热、金属包覆或非包覆）（取代MIL-S-13949/10B）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/10C

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/10B) (NO S/S DOCUMENT)
基材GI层压印刷线路板（编织E玻璃增强、聚酰亚胺树脂、耐热、金属包覆或非包覆）（替代MIL-S-13949/10B）（无S/S文件）

1993-08-06

现行

QPL QPL-19161-23 Notice 1-Cancellation

PLASTIC SHEET, LAMINATED, GLASS CLOTH POLYTETRAFLUOROETHYLENE RESIN (NO S/S DOCUMENT) (SUPERSEDING QPL-19161-22)
玻璃布聚四氟乙烯树脂层压塑料板（无S/S文件）（代替QPL-19161-22）

1992-04-21

现行

QPL QPL-19161-23 Notice 1-Cancellation

PLASTIC SHEET, LAMINATED, GLASS CLOTH POLYTETRAFLUOROETHYLENE RESIN (NO S/S DOCUMENT) (SUPERSEDING QPL-19161-22)
玻璃布聚四氟乙烯树脂层压塑料板（无S/S文件）（代替QPL-19161-22）

1992-04-21

现行

MIL MIL-G-21854 Notice 1-Cancellation

GLOVES, PROTECTIVE, FUEL AND OXIDIZER RESISTANT (RESIN MODIFIED BUTYL) (NO S/S DOCUMENT)
防护手套 耐燃油和氧化剂（树脂改性丁基）（无S/S文件）

1998-01-22