规定了无氧高导电性铜鳞片附着力测试的原理和方法，主要用于涉及玻璃到金属密封件的电子设备或其他需要附着力氧化铜膜的用途。

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.