IEC 62899-201-2:20 21（E）定义了可拉伸基材性能的测量方法，以便用于评估由印刷技术形成的可拉伸功能层（导电、半导体和绝缘）。如果与基材相同类型的材料用于覆盖层膜，则它们也经受本文所定义的测量。 本文所处理的可拉伸基板适用于经受具有高水平性能的布线元件的重复弯曲的基板，诸如织物集成的可穿戴设备或皮肤可贴片设备。 该文献没有定义可拉伸基底的所需特性。它提供了表征（预合格）用于印刷导体和绝缘体以制造可拉伸层或结构的基材的测试方法。

IEC 62899-201-2:2021(E) defines measurement methods for the properties of stretchable substrates, in order to use evaluating stretchable functional layers (conductive, semiconducting, and insulating) formed by printing technologies. If the same types of materials as the substrates are used for the cover lay film, they are also subjected to the measurement defined in this document.
Stretchable substrates handled by this document apply to substrates subjected to repeated bending with wiring elements demanding a high level of performance, such as fabric integrated wearable devices or skin patchable devices.
This document does not define the required characteristics of the stretchable substrate. It provides test methods to characterize (pre-qualify) the substrates that are intended to be used for printing conductors and insulators for the purposes of manufacturing stretchable layers or structures.