现行

GB/T 14113-1993

半导体集成电路封装术语
Terminology of packages for semiconductor inte-grated circuits

1993-01-21

现行

GB/T 2900.66-2004

电工术语 半导体器件和集成电路
Electrotechnical terminology--Semiconductor devices and integrated circuits

2004-05-10

现行

SJ/T 10176-1991

半导体集成电路金属菱形外壳详细规范
Detail specification for metal rhomb package of semiconductor integrated circuits

1991-05-28

现行

GB/T 15878-2015

半导体集成电路 小外形封装引线框架规范
Semiconductor integrated circuits—Specification of leadframes for small outline package

2015-05-15

现行

GB/T 15876-2015

半导体集成电路 塑料四面引线扁平封装引线框架规范
Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package

2015-05-15

现行

GB/T 9178-1988

集成电路术语
Terminology for integrated circuits

1988-05-19

现行

BS IEC 63011-1-2018

Integrated circuits. Three dimensional integrated circuits-Terminology
集成电路 三维集成电路

2019-01-24

现行

BS IEC 60748-5-1997

Semiconductor devices. Integrated circuits-Semicustom integrated circuits
半导体器件 集成电路 半定制集成电路

1997-08-15

现行

BS IEC 60748-2-1997

Semiconductor devices. Integrated circuits-Digital integrated circuits
半导体器件 集成电路 数字集成电路

1998-04-15

现行

BS IEC 60748-11-2000

Semiconductor devices. Integrated circuits-Sectional specification for semiconductor integrated circuits excluding hybrid circuits
半导体器件 集成电路 不包括混合电路的半导体集成电路分规范

2011-07-31

现行

GB/T 16525-2015

半导体集成电路 塑料有引线片式载体封装引线框架规范
Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package

2015-05-15

现行

GB/T 14862-1993

半导体集成电路封装结到外壳热阻测试方法
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits

1993-12-30

现行

SJ/T 10307-1992

半导体集成电路陶瓷熔封扁平外壳详细规范
Detail specification for frit-seal ceramic flat package of semiconductor integrated circuits

1992-06-15

现行

GB/T 12842-1991

膜集成电路和混合膜集成电路术语
Terminology for film integrated circuits and hybrid film integrated circuits

1991-04-28

现行

BS 6493-2.3-1987

Semiconductor devices. Integrated circuits-Recommendations for analogue integrated circuits
半导体器件 集成电路 模拟集成电路的推荐标准

1987-01-30

现行

KS C IEC 60050-521(2017 Confirm)

반도체 소자 - 집적회로 용어
半导体器件和集成电路

2002-03-29

现行

KS C IEC 60050-521(2022 Confirm)

반도체 소자 - 집적회로 용어
半导体器件和集成电路

2002-03-29

现行

IEC 60748-11-1990

Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
半导体器件 - 集成电路 - 第11部分:不包括混合电路的半导体集成电路的分段规范

1990-12-20

现行

KS C IEC 60748-11

반도체 소자 — 집적 회로 — 제11부:반도체 집적 회로에 대한 품종 규격(혼성 회로 제외)
半导体器件 - 集成电路 - 第11部分:不包括混合电路的半导体集成电路的分段规范

2020-07-23

现行

GB/T 12750-2006

半导体器件 集成电路 第11部分：半导体集成电路分规范（不包括混合电路）
Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

2006-08-23