现行

HG/T 4617-2014

酯化树脂催化剂
Ester resin catalyst

2014-05-06

现行

HG/T 5876-2021

环氧乙烯基酯树脂
Epoxy vinyl ester resin

2021-03-05

现行

ASM P-29

DERAKANE 411-45 - Vinyl Ester Resin
DERAKANE 411-45-乙烯基酯树脂

1991-08-01

现行

ASM P-29

DERAKANE 411-45 - Vinyl Ester Resin
DERAKANE 411-45-乙烯基酯树脂

1991-08-01

现行

MIL MIL-R-24719

RESINS, VINYL ESTER, LOW PRESSURE LAMINATING
树脂 乙烯基酯 低压层压

1989-05-04

现行

ASM P-31

DERAKANE 8084 - Elastomer Modified Vinyl Ester Resin
DERAKANE 8084-弹性体改性乙烯基酯树脂

1991-11-01

现行

ASM P-31

DERAKANE 8084 - Elastomer Modified Vinyl Ester Resin
DERAKANE 8084-弹性体改性乙烯基酯树脂

1991-11-01

现行

GB/T 50590-2010

乙烯基酯树脂防腐蚀工程技术规范(附条文说明)
Technical code for anticorrosion engineering of vinyl ester resins

2010-05-31

现行

JIS K 6940-1998

Glass flakes vinyl ester resin lining films
玻璃鳞片乙烯基酯树脂衬里膜

1998-01-01

现行

ASM P-35

DERAKANE 510A - Epoxy Vinyl Ester Resin Without Additives
DERAKANE 510A-不含添加剂的环氧乙烯基酯树脂

1992-06-01

现行

GB/T 42790-2023

丙烯酸共聚聚氯乙烯树脂
Acrylic ester / vinyl chloride graft co-polymer resin

2023-08-06

现行

ASM P-35

DERAKANE 510A - Epoxy Vinyl Ester Resin Without Additives
DERAKANE 510A-不含添加剂的环氧乙烯基酯树脂

1992-06-01

现行

ASM P-12

DERAKANE 470-36 and 470-45 - Thermosetting Vinyl Ester Resins
DERAKANE 470-36和470-45-热固性乙烯基酯树脂

1989-11-01

现行

ASM P-12

DERAKANE 470-36 and 470-45 - Thermosetting Vinyl Ester Resins
DERAKANE 470-36和470-45-热固性乙烯基酯树脂

1989-11-01

现行

BS 2782-4-METHOD 433A-1979

Methods of testing plastics. Chemical properties-Determination of inorganic chlorine in epoxide resins and glycidyl esters
塑料的试验方法 化学性质 环氧树脂和缩水甘油酯中无机氯的测定

1979-06-29

现行

CJ/T 218-2010

给水用丙烯酸共聚聚氯乙烯管材及管件
Pipe and fittings of acrylic ester/vinyl chloride graft co-polymer resin for water supply

2010-03-15

现行

SJ/T 11481-2014

多层印制板用氰酸酯改性环氧玻纤布粘结片预浸料
Prepreg used as bonding sheets for multilayer printed boards-Cyanate ester modified epoxy resin-impregnated glass cloth

2014-10-14

现行

MIL MIL-S-13949/30A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/30) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GC（编织E玻璃增强、多数氰酸酯树脂、阻燃）（替代MIL-S-13949/30）（无S/S文件）

1993-05-18

现行

MIL MIL-S-13949/28A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL SC (WOVEN S-2 GLASS FIBER 1/ REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/28) (NO S/S DOCUMENT)
片材 印刷线路板 预浸料 基材SC（编织S-2玻璃纤维1/增强 多数氰酸酯树脂 阻燃）（取代MIL-S-13949/28）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/29A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/29) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GC（编织电子玻璃增强材料 多数氰酸酯树脂 阻燃 金属包覆或非包覆）（取代MIL-S-13949/29）（无S/S文件）

1997-08-01