现行

SJ/T 10668-2002

表面组装技术术语
Terminology for surface mount technology

2002-10-30

现行

BS EN IEC 61760-1-2020

Surface mounting technology-Standard method for the specification of surface mounting components (SMDs)
表面安装技术

2020-10-02

现行

IPC TA-723

Technology Assessment Handbook on Surface Mounting
表面安装技术评估手册

现行

SJ/T 11518-2015

表面贴装技术印刷模板
Surface Mount Technology Print Stencil

2015-04-30

现行

SJ/T 10670-1995

表面组装工艺要求
General requirements for workmanship of surface mount technology

1995-08-18

现行

BS EN IEC 61760-2-2021

Surface mounting technology-Transportation and storage conditions of surface mounting devices (SMD). Application guide
表面安装技术

2021-09-10

现行

KS C IEC 61760-1(2017 Confirm)

표면실장기술 －제1부：표면실장부품(SMD)의 규격을 위한 표준방법
表面安装技术第1部分:表面安装元件规范的标准方法

2007-11-29

现行

GB/T 19405.1-2003

表面安装技术　第1部分：表面安装元器件(SMDS)规范的标准方法
Surface mounting technology—Part 1:Standard method for the specification of surface mounting components(SMDs)

2003-11-24

现行

KS C IEC 61760-1(2022 Confirm)

표면실장기술 －제1부：표면실장부품(SMD)의 규격을 위한 표준방법
表面安装技术－第1部分:表面安装元件（SMD）规范的标准方法

2007-11-29

现行

IEC 61760-1-2020

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
表面贴装技术 - 第1部分:表面贴装元件（Smds）规范的标准方法

2020-07-14

现行

GB/T 19405.2-2003

表面安装技术　第2部分：表面安装元器件的运输和贮存条件——应用指南
Surface mounting technology—Part2:Transportation and storage conditions of surface mounting devices(SMD)—Application guide

2003-11-24

现行

BS EN 62137-1-4-2009

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint-Cyclic bending test
表面安装技术 表面安装焊点的环境和耐久性试验方法

2009-03-31

现行

BS EN 62137-1-2-2007

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint-Shear strength test
表面安装技术 表面安装焊点的环境和耐久性试验方法

2007-10-31

现行

BS EN 62137-1-1-2007

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint-Pull strength test
表面安装技术 表面安装焊点的环境和耐久性试验方法

2007-10-31

现行

IEC 61760-2-2021 RLV

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
表面安装技术.第2部分:表面安装装置（SMD）的运输和储存条件.应用指南

2021-07-16

现行

IEC 61760-2-2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
表面安装技术 - 第2部分:表面安装器件（SMD）的运输和存储条件 - 应用指南

2021-07-16

现行

KS C IEC 61760-2(2020 Confirm)

표면실장기술－제2부：표면실장부품(SMD)의 운송과 보관조건－적용가이드
表面安装技术第2部分:表面安装器件（SMD）的运输和储存条件应用指南

2009-12-01

现行

JIS C 5070-2009

Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) -- Application guide
表面安装技术第2部分:表面安装器件（SMD）的运输和储存条件应用指南

2009-01-01

现行

BS EN 62137-1-3-2009

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint-Cyclic drop test
表面安装技术 表面安装焊点的环境和耐久性试验方法

2009-03-31

现行

BS EN 62137-1-5-2009

Surface mounting technology. Environmental and endurance test methods for surface mount solder joints-Mechanical shear fatigue test
表面安装技术 表面安装焊点的环境和耐久性试验方法

2009-07-31